Analyzing Intel's EMIB and Foveros advanced packaging roadmaps
Intel was the first large chipmaker to start using advanced packaging methods in 2017 – 2019. But where are Intel's EMIB and Foveros technologies today and where are they heading?
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Advanced packaging technologies have become integral parts of advanced CPU and GPU designs, and virtually all of Intel's high-end client and data center CPUs rely on its Embedded Multi-die Interconnect Bridge (EMIB) and Foveros technologies. But what's next for these two advanced packaging methods? Before we try to see where both technologies are going, let's first take stock of where we are today.
Although Intel's advanced packaging saga began in 2017 with the Kaby Lake-G CPUs and Stratix 10 FPGAs, packaging technologies weren't quite the hot topic they are today. However, both Intel and its…
